Process Integration Engineer

About the role

SSMC, a joint venture between NXP and TSMC, offers semiconductor fabrication solutions in a fully equipped SMIF cleanroom with automated equipment and proven wafer-manufacturing processes. It is hiring a Process Integration Engineer for its Integration, Process Integration - TSMC II department.

Key responsibilities

• Lead the development, transfer and maintenance of advanced CMOS fabrication technology with good process capability and high yield.
• Manage the integration of all module processes and their derivatives, and lead new technology transfers from the mother fab or process development.
• Own new tapeout prototype lots and ensure a 100% success rate.
• Improve process robustness through root cause analysis and collaboration on improvement actions to meet 100% wafer acceptance test (WAT) and Cpk goals.
• Escalate quality concerns, empower action on deviations and stop at the source immediately.
• Work with product engineers on low-yield issues and plan product-specific process tuning to meet baseline yield targets.
• Collaborate with Customer Account Management to resolve customer complaints and provide the information needed to satisfy customers.
• Lead a sub-team in cross-functional continuous improvement projects.

Required profile

• Bachelor's degree in Electrical or Electronic Engineering or equivalent.
• Minimum 1 to 3 years of relevant experience in a semiconductor fab environment preferred; fresh graduates are welcome as training will be provided.
• Comfortable speaking Mandarin, as the role involves working with Mandarin-speaking TSMC mother fabs and customers.

Required skills

• Knowledge of various process modules and semiconductor devices.
• Automotive quality mindset and stop-and-fix mindset.
• Strong 8D problem-solving, presentation and communication skills.
• Failure analysis and SPC knowledge.
• Proficiency in Microsoft applications and statistical analysis tools; JMP is an added advantage.