Staff Engineer – HIG‑HBM Product Engineering (Reliability)

About the role

We are looking for a Staff Engineer to lead reliability engineering for our high‑bandwidth memory (HBM) products. The role focuses on developing test flows, reducing defect rates, and ensuring product quality across the manufacturing lifecycle.

Key responsibilities

• Define and develop reliability stress test flows and comprehensive test plans covering all product reliability aspects.
• Collaborate with Global Quality to create qualification plans, monitor execution, and resolve gating issues.
• Drive down DPM (defects per million) by optimizing manufacturing test flows and strategies to meet quality, cost, and cycle‑time KPIs.
• Perform root‑cause analysis of qualification and RMA device issues using electric and physical failure analysis, and lead cross‑functional remediation.
• Provide recommendations for fab process conversions to improve yield, cost, and reliability of HBM products.
• Communicate risk assessments with product managers and lead risk‑management for process changes.
• Promote innovative solutions to maintain Micron’s technical advantage.
• Mentor and develop team members, and contribute to project management and technical decision‑making.

Required profile

• Extensive experience in semiconductor reliability engineering, preferably with memory products.
• Proven ability to lead cross‑functional teams and manage complex projects.
• Strong analytical skills for failure analysis and risk assessment.
• Excellent communication skills for collaboration with fab, design, and quality teams.

Required skills

• Electric Failure Analysis (EFA)
• Physical Failure Analysis (PFA)
• Reliability test flow development
• DPM reduction strategies