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Yield Enhancement Engineer

Micron Technology · Singapour

🇬🇧 English
Electrical Failure Analysis Fault isolation Hamamatsu iPHEMOS Thermo Fisher ELITE Physical Failure Analysis

Job description

About the role

The Yield Enhancement Engineer is responsible for electrical failure analysis and fault isolation of advanced semiconductor devices. Working with specialized diagnostic equipment, the engineer identifies root causes of yield loss, supports product quality and reliability, and collaborates with cross‑functional teams to drive continuous improvement.

Key responsibilities

  • Perform Electrical Failure Analysis (EFA) and fault isolation on semiconductor devices.
  • Operate tools such as Hamamatsu iPHEMOS, Thermo Fisher ELITE, and other photon, thermal, or laser emission systems.
  • Characterize probe test and internal qualification failure signatures.
  • Use layout and schematic information to model failure signatures and aid fault isolation.
  • Apply physical failure analysis (PFA) and de‑processing techniques as needed.
  • Understand fabrication process steps, package assembly, and semiconductor design.
  • Generate clear, timely failure analysis reports with cause‑and‑effect documentation.
  • Integrate AI‑assisted tools to improve analysis efficiency and quality.

Required profile

  • Bachelor's or advanced degree in Electrical Engineering, preferably with a focus on microelectronics or circuit design.
  • Strong analytical, logical and critical‑thinking abilities.
  • Effective communication skills and ability to work collaboratively.
  • Growth mindset with a passion for continuous learning.
  • Internship or experience in the semiconductor industry is a plus.
  • Interest in the semiconductor sector and familiarity with Micron is preferred.

Required skills

  • Electrical Failure Analysis (EFA)
  • Fault isolation techniques
  • Hamamatsu iPHEMOS operation
  • Thermo Fisher ELITE operation
  • Photon, thermal and laser emission testing
  • Probe test characterization
  • Physical Failure Analysis (PFA) and de‑processing
  • Understanding of semiconductor device design and layout
  • Knowledge of fabrication processes and package assembly
  • AI‑assisted analysis tools

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Published 1 month ago

Expires 3 days from now

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Micron Technology

Singapour