Advanced Packaging 2.5D and Deep Trench Integration Engineer

About the role

GlobalFoundries' CMOS product team is looking for a Singapore-based Advanced Packaging 2.5D and Deep Trench Integration Engineer to join its local technology development organization. The engineer supports and drives integration of 2.5D solutions and deep trench (DT) technologies from early process development and test-vehicle execution through qualification and manufacturing readiness, coordinating module interfaces, running experiments and analyzing electrical and physical data.

Key responsibilities

• Support and drive process integration for 2.5D and deep trench technology programmes, turning product and technology requirements into integration plans, experiments and deliverables.
• Integrate deep trench process modules, including trench formation, dielectric and electrode materials, fill, planarisation, thermal processing, isolation, contact formation and electrical characterisation.
• Support end-to-end integration of 2.5D solutions such as silicon interposers, TSVs, redistribution layers, wafer thinning and bonding, assembly flows and package integration.
• Plan and execute test structures, process splits and structured DOEs to establish process windows and retire technical risks.
• Analyze inline, physical, electrical, defectivity, yield and reliability data, identify trends and failure mechanisms and recommend corrective actions.
• Partner with module, device, design, reliability, test, manufacturing and equipment teams to resolve integration issues and improve process stability and manufacturability.
• Maintain integration documentation, process-flow requirements, experiment plans, technical reports, risk assessments and milestone updates.
• Present technical findings, trade-offs and recommendations to project teams and management, and contribute to customer and partner technical discussions.
• Work safely and meet EHS and security requirements; travel up to 15% to other GlobalFoundries sites, suppliers, partners or customers.

Required profile

• Bachelor's degree or higher in Electrical, Materials, Mechanical, Chemical Engineering, Physics or a related field.
• Relevant experience in semiconductor process integration, device integration, advanced packaging or technology development: B.S. with at least 5 years, M.S. with at least 3 years, or Ph.D. with research or industry experience.
• Hands-on experience in deep trench integration and/or 2.5D technology development.
• Ability to work across cross-functional engineering and manufacturing teams with limited supervision, and strong written and verbal English.
• Currently based in Singapore or willing to relocate and work on site.

Required skills

• Deep trench etch, dielectric formation, electrode or trench fill, planarisation, thermal processing, electrical characterisation
• Silicon interposers, TSVs, redistribution layers, wafer thinning, bonding, assembly and package qualification
• Preferred: experience with deep trench capacitors, isolation, 2.5D interposer flows, metrology, failure analysis, DOE and process control