R&D Applications Manager (Thermal Interface Materials)

About the role

MacDermid Alpha Electronics Solutions is looking for an experienced R&D Applications Manager to lead research and development for its chemical business in the packaging and board assembly segment. The role coordinates the application and formulation teams into a coherent strategy for new thermal interface material (TIM) product development, working closely with commercial, operations, regulatory, quality, supply chain and global R&D teams.

Key responsibilities

• Manage the TIMs material technical strategy, including periodic strategy and roadmap refreshes based on customer feedback, internal roadmaps and market trends.
• Lead both the application and formulation parts of the TIMs team, including up to 8 non-co-located employees and dotted-line CTS personnel, and help build and staff an expanded team.
• Develop and improve core product development and validation strategies.
• Take part in key customer interfaces such as TRM exchanges, quality issues, new product launches and training, and feed learnings back into strategy.
• Act as a technical industry expert, identify future capabilities and needs, and propose new projects to management.
• Work with CTS and sales to leverage ESI capabilities and keep a path open for global technical escalations.
• Own and manage the CapEx strategy and budget for the technical team, and manage performance and career development of direct reports.

Required profile

• MSc in Materials Science, Metallurgy, Mechanical or Chemical Engineering, with at least 8 years of relevant experience, or a PhD with at least 2 years of directly related experience.
• Ability to present technical information clearly to senior leadership, cross-functional teams, customers and external stakeholders.
• Strong problem-solving skills and the ability to turn laboratory insights into practical development recommendations.

Required skills

• Background in metallurgical analysis, material characterization, application and reliability testing.
• Expertise in semiconductor board and assembly processing, or wafer-level packaging.
• Hands-on experience with TIM1/1.5 materials.
• Interpretation of scientific literature, technical standards and test methods, and analysis of complex datasets.

What we offer

• A competitive base salary and a performance-related bonus scheme.
• Corporate medical insurance and annual leave.