Research Fellow – Flexible Electronics

About the role

We are seeking a highly motivated Research Fellow to develop soft, stretchable interconnect technologies for next‑generation flexible electronic devices at NTU’s School of Materials Science and Engineering. The role combines design, fabrication and reliability testing of conductive interconnects on deformable substrates, bridging materials science and printed electronics.

Key responsibilities

• Design, fabricate and characterize stretchable interconnects and bonded joints using printable conductive materials and low‑temperature or photonic sintering/bonding methods.
• Develop conductive inks, nanoparticle‑based composites and interlayer designs to ensure reliable soft interconnections.
• Perform microstructural, chemical, mechanical and electromechanical testing, including reliability evaluation under bending, stretching and cyclic deformation.
• Collaborate with interdisciplinary teams to integrate soft‑interconnect solutions into stretchable sensors and device platforms.
• Contribute to manuscript preparation, conference presentations, grant proposals and supervise junior researchers.

Required profile

• PhD in Materials Science, Electrical/Electronic Engineering, Mechanical Engineering, Chemistry or a related discipline.
• Demonstrated research experience in flexible/stretchable electronics, printed electronics or low‑temperature bonding of advanced materials.
• Strong background in interfacial engineering, joint design and characterization of printed or bonded interfaces on soft substrates.
• Track record of publications in reputable journals and ability to drive research projects independently.

Required skills

• Conductive ink formulation and printing
• Photonic or low‑temperature sintering/bonding
• Nanoparticle and nanocomposite conductive material development
• Microstructural, chemical and mechanical characterization
• Electromechanical testing of stretchable interconnects
• Stretchable device fabrication