Senior R&D Engineer – Advanced Technology Development (PKE)

About the role

The Senior R&D Engineer will lead advanced technology development for next‑generation silicon node packages (5nm, 3nm, 2nm and beyond). You will collaborate with marketing, IC design and thermal teams to create cost‑effective, high‑performance custom packages.

Key responsibilities

• Define optimum package solutions balancing cost, performance, manufacturability and reliability for advanced node products.
• Design custom packages with IC, system, SI/PI and thermal engineering teams, ensuring compliance with CPI, SI/PI and stringent thermal requirements.
• Research, develop and productize new materials such as TIM, build‑up films and underfills for advanced nodes.
• Manage packaging activities from concept through qualification to high‑volume production, including BOM definition, process troubleshooting and documentation.
• Collaborate with QA, customers, suppliers and internal functional groups to resolve quality issues and support NPI bring‑up.

Required profile

• BS/MS/PhD in STEM, Material Science, Electrical or Mechanical Engineering with 8+ years (BS), 6+ years (MS) or 3+ years (PhD) of relevant experience.
• Deep knowledge of signal‑integrity and power‑integrity concepts, advanced substrate manufacturing, and failure‑analysis techniques for 5nm‑2nm products.
• Hands‑on expertise with advanced assembly processes (flip‑chip, MCM, 2.5D) and familiarity with wafer BEOL interactions.
• Strong project‑management, communication and leadership abilities, plus ability to read GD&T mechanical drawings.

Required skills

• Cadence APD for custom substrate design
• Signal‑integrity and power‑integrity analysis (impedance, s‑parameters)
• Advanced assembly processes (flip‑chip, MCM, 2.5D)
• Thermal interface material (TIM) development
• Failure analysis (ELK, MiM structures)
• GD&T interpretation
• Design of Experiments (DOE) and process capability analysis
• Advanced substrate technologies (SAP/mSAP, PSPI with Cu RDL)