System Engineer - Die Bonding

About the role

A System Engineer for die bonding equipment in the semiconductor industry is sought in Singapore. The role covers the development of hardware and software modules for Die Bonder machines, including analysis, modelling, calculation, measurement and qualification, and works with an interdisciplinary team of mechanics, electronics, software and motion control engineers.

Key responsibilities

• Define hardware and software requirements for the development team.
• Conduct and analyse experiments to identify suitable system parameters and machine production sequences.
• Optimise the Die Bonder system for accuracy, stability and productivity.
• Develop die bonding process technologies according to current or future customer needs.
• Support internal and external customers, product management on customer projects and manufacturing engineering on assembly and supplier issues; occasional business travel required.
• Interpret, document and present new results.

Required profile

• University-level technical education, ideally microsystem technology, mechanical, electrical or mechatronic engineering.
• Work experience in semiconductor or mechanical/electrical engineering is advantageous.
• Knowledge, experience and practice on ESG initiatives.

Required skills

• Mathematics, mechatronics or materials science expertise.
• Hands-on lab work and experience with measurement equipment.
• Microsoft Office and programming knowledge.
• Ability to present complex topics to different audiences, teamwork, initiative and flexibility under pressure.