Principal Process Engineer – Etch

About the role

As a Principal Engineer focusing on Etch, you will be a key technical leader in the Process Module team, responsible for developing, optimizing, and sustaining cutting‑edge etch processes for advanced semiconductor nodes.

Key responsibilities

• Develop and modify etch process formulations, tool controls, and recipes to meet stringent quality standards and technology specifications.
• Analyze technical data to ensure etch performance, addressing non‑uniformity, defectivity, and removal‑rate stability.
• Establish and maintain SOPs and FMEA documentation specific to the etch module.
• Lead continuous‑improvement plans, drive cross‑functional collaboration, and mentor junior engineers.
• Solve complex, non‑recurring technical problems and contribute to patents and publications.
• Perform all activities safely and in compliance with Environmental, Health, Safety & Security requirements.

Required profile

• Master’s or Bachelor’s degree in Electrical, Electronics, Mechanical, Chemical, Materials Science Engineering or a related field.
• 5–8 years of wafer‑fabrication experience with a strong focus on etch processes.
• Strong analytical, project‑management, and problem‑solving abilities; familiar with SPC, DOE and FMEA.
• Excellent interpersonal and communication skills for cross‑functional teamwork.

Required skills

• Etch process development and optimization
• Etch tool recipe creation and maintenance
• Statistical Process Control (SPC)
• Design of Experiments (DOE)
• Failure Mode and Effects Analysis (FMEA)