Process Integration Engineer

About the role

The Process Integration Engineer will be responsible for driving yield improvement and ensuring robust manufacturing for front‑end semiconductor processes. Working within Qualcomm’s hardware engineering team in Singapore, you will collaborate with cross‑functional groups to analyse failures, optimise processes and support new technology introductions.

Key responsibilities

• Own front‑end process yield performance, conduct wafer scrap analysis and lead root‑cause investigations.
• Design and execute Design of Experiments, apply statistical techniques and advanced quality tools to optimise process windows.
• Plan, coordinate and implement process changes through Limited Change Requests, ECNs and qualification activities while managing manufacturing risk.
• Support engineering runs, create process flows, coordinate tooling and documentation for new product introductions and monitor ramp‑up performance.
• Drive Design for Manufacturability initiatives to improve product yield, quality and cost.

Required profile

• Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering or a related field.
• Experience with front‑end semiconductor process yield analysis and improvement.
• Strong analytical mindset with the ability to conduct data‑driven investigations.

Required skills

• Design of Experiments (DoE)
• Statistical analysis and advanced quality tools
• Wafer scrap analysis
• Process optimization and change management
• FPGA and DSP knowledge
• Design for Manufacturability (DFM)