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Account Technologist - PVD Advanced Packaging

amat · Sgp

New
Senior 🇬🇧 English
SPC DOE Metrology Yield analytics Thin-film metallurgy JEDEC TDDB

Job description

About the role

Applied Materials is hiring an Account Technologist for its PVD advanced packaging business in Singapore. The role acts as the technical owner for PVD solutions at assigned OSAT and Fabless accounts, bridging design requirements and manufacturing processes. The work location is Science Park II, moving to Tampines from mid-2027.

Key responsibilities

  • Partner with Fabless packaging architects to define material stacks, reliability criteria and integration flows, then turn them into executable solutions for OSATs
  • Lead joint qualification programs: define success metrics, DoEs and acceptance gates, and manage execution to schedule
  • Establish process-of-record (POR) for advanced packaging applications such as RDL barrier/seed, TSV liners and hybrid bonding underlayers
  • Drive tool acceptance (FAT/SAT) and high-volume ramp at OSAT sites, including SPC setup, chamber matching, defectivity control and yield stabilization
  • Validate PVD film integrity under Fabless reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling)
  • Work with Product Engineering, Field Service and Quality teams to resolve integration challenges such as ESD, adhesion, contamination and stress
  • Lead root cause analysis on yield and reliability excursions, implement corrective actions and give feedback to internal engineering

Required profile

  • Bachelor's or Master's in Materials Science, Physics, Chemical Engineering or a related field; PhD preferred
  • 10+ years in semiconductor equipment/process engineering with strong PVD experience in advanced packaging (FO-WLP, 2.5D/3D, RDL/UBM)
  • Proven success enabling solutions through direct engagement with OSATs and Fabless design houses
  • Preferred: experience with hybrid bonding or chiplet integration underlayers, familiarity with the APAC OSAT ecosystem, and strong communication with executive Fabless stakeholders

Required skills

  • SPC, DOE, metrology and yield analytics
  • Thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design

The position is full-time, with travel of about 50% of the time and relocation eligibility.

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Source : ats:workday

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Published 5 hours ago

Expires 1 month from now

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amat

Sgp