CMP Equipment Engineer

About the role

Qualcomm is seeking a CMP Equipment Engineer to plan, design, optimize, verify and test electronic systems and equipment used in semiconductor manufacturing. The role involves hands‑on involvement with digital, analog, RF and optical circuits, as well as FPGA and DSP platforms, to ensure high‑quality, reliable product delivery.

Key responsibilities

• Design, verify and test electronic, mechanical and packaging systems, including Digital/Analog/RF/optical subsystems.
• Lead equipment fault investigations, drive cost‑reduction initiatives and implement continuous‑improvement programs.
• Enforce equipment maintenance controls, develop preventive‑maintenance procedures and manage spare‑parts inventory.
• Guide and train technicians on equipment problem‑solving, analysis and troubleshooting.
• Create technical specifications for new or transferred equipment and oversee equipment move‑in, installation, set‑up and buy‑off.
• Maintain compliance with CSR, EHS, QM, ESD, 5S and cleanroom protocols.

Required profile

• Bachelor’s degree in Electronic, Electrical, Mechanical Engineering or a related field.
• Knowledge of semiconductor process technology and statistical/quality tools.
• Strong technical competency in hardware engineering and ability to work under pressure.
• Proficiency with computer systems and MS Office (PowerPoint, Excel, Word).
• Accountable, team‑oriented mindset with a focus on continuous improvement.

Required skills

• Semiconductor process technology
• Statistical and quality analysis tools
• MS PowerPoint, MS Excel, MS Word
• Design and verification of Digital, Analog, RF and Optical systems
• FPGA and DSP development
• Equipment fault investigation and continuous‑improvement techniques
• Equipment maintenance and preventive‑maintenance procedures
• Risk assessment and troubleshooting guidelines
• Technical specification creation for equipment
• Vendor management and spare‑parts control
• Compliance with cleanroom, CSR, EHS, QM, ESD and 5S standards