Director, Advanced Packaging Disruptive Technology

About the role

The Director will shape Applied Materials' long‑term innovation trajectory in advanced packaging by defining and executing a forward‑looking path‑finding roadmap (N+2 and beyond). This senior leader will build and inspire a high‑impact team that explores disruptive packaging concepts and translates early‑stage ideas into scalable solutions for customers worldwide.

Key responsibilities

• Define and execute a long‑range roadmap for next‑generation advanced packaging, identifying inflection points in integration, interconnect, materials and architectures.
• Drive concept incubation, feasibility studies and rapid prototyping of disruptive approaches such as novel interconnect schemes, heterogeneous integration and advanced substrate innovations.
• Evaluate emerging technology options and guide make/buy/partner decisions to establish differentiated capability ahead of industry adoption cycles.
• Build, lead and mentor a world‑class path‑finding team, fostering a culture of bold experimentation and structured idea generation.
• Translate customer roadmaps, system‑architecture trends and market inflections into actionable technology development strategies.
• Establish and manage a collaborative ecosystem with material suppliers, substrate vendors, OSATs, foundries, equipment partners and research institutions.
• Set governance models for early‑stage programs, align engineering and business units, and communicate executive‑level narratives on technology trade‑offs and strategic priorities.

Required profile

• 15+ years of experience in semiconductor technology, including advanced packaging, front‑end processing or adjacent domains.
• Proven leadership in technology path‑finding, innovation strategy or early‑stage platform development.
• Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV) and ability to think beyond existing paradigms.
• Experience building and leading cross‑functional exploratory R&D teams.
• Ability to translate complex technology concepts into business impact and strategic direction.

Required skills

• Advanced packaging technologies (D2W, RDL, CoWoS, TSV)
• Semiconductor technology and materials science
• Heterogeneous integration and chiplet ecosystems
• Technology road‑mapping and strategic planning