Engineer, HIG-HBM Product Engineering (Reliability Test Coding)

About the role

Micron is looking for an engineer in its High Bandwidth Memory (HBM) Product Engineering team, based in Singapore with international travel to the US, Taiwan and Japan. The role covers reliability test program coding for Micron's latest HBM products, including writing and debugging test programs for device and package qualification, and developing new reliability test flows such as extended wafer-level burn-in, pWLRx and ELFR for DRAM, interface dies and stacked products.

Key responsibilities

• Write and debug test programs for HBM device and package qualification, working with other teams to ensure full test coverage.
• Understand and resolve root causes of reliability test program issues.
• Promote innovation and change, such as new reliability features and infrastructure optimization.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.
• Analyze engineering data with in-house statistical tools for validation and risk assessment.
• Define interface hardware specifications, validate and debug new interface boards.
• Make final decisions on risk analysis and project prioritization.
• Mentor others, manage projects and identify process improvements.
• Integrate AI-assisted tools into daily work and share AI-enabled enhancements.

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering; product or test engineering experience preferred.
• Proven experience in reliability engineering or a related role.
• Strong technical problem-solving skills, attention to detail and good multi-tasking.
• Effective written and spoken English and proven collaborative work across teams.
• Ability to follow testing protocols strictly.

Required skills

• Strong coding in Python and C++ (a must).
• Basic understanding of CMOS technology and DRAM device physics and design.
• Good knowledge of statistics, data analysis tools and scripting.
• Familiarity with testing and verification approaches.