Engineer – Product Yield Enhancement (PFA)

About the role

The Engineer, Product Yield Enhancement (PYE) supports physical failure analysis activities for memory products, focusing on fault isolation, de‑capsulation, circuit edit support, and failure characterization. The role contributes to yield, quality, and reliability improvement by identifying failure mechanisms and providing actionable technical findings.

Key responsibilities

• Perform failure analysis activities to identify defect locations, failure mechanisms, and electrical failure modes in memory devices.
• Analyze device architecture, fabrication processes, device operation, and device physics to support root‑cause investigations.
• Collaborate with cross‑functional teams to present analysis results and support corrective actions for yield, quality, and reliability improvements.
• Maintain readiness and effective utilization of laboratory equipment, analytical tools, and failure analysis methodologies.
• Adhere to laboratory safety requirements, operational procedures, and quality standards.
• Document technical findings, analysis results, and learnings in accordance with organizational standards.
• Support continuous improvement activities related to laboratory capability, operational efficiency, and knowledge sharing.
• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements.

Required profile

• Bachelor’s degree in Electrical and Electronics Engineering, Microelectronics, Mechatronics, Materials Science, or a related engineering discipline.
• Understanding of semiconductor device operation, device physics, memory architecture, and fabrication processes.
• Strong analytical and structured problem‑solving skills.
• Clear technical communication and presentation skills.
• Cross‑functional collaboration and stakeholder engagement.
• Disciplined execution with strong attention to detail.

Required skills

• Fault isolation
• De‑capsulation
• Circuit edit support
• Failure characterization
• Device physics analysis
• AI‑assisted tools