Hybrid Bonding Technology Development Engineer (Wet Clean)

About the role

As a Process Engineer at Applied Materials, you will design and optimise manufacturing processes for display and semiconductor technologies. The role involves collecting and analysing data, performing hardware characterisation, and troubleshooting complex engineering issues to advance hybrid bonding capabilities.

Key responsibilities

• Design experiments, collect data, analyse results and compile reports on challenging process engineering studies.
• Measure film and surface properties, interpret data and optimise processes to push product performance to hardware limits.
• Generate innovative ideas to enable hybrid bonding and guide prototyping efforts.
• Perform hardware characterisation on a variety of complex systems and implement new technologies, products and analytical instrumentation.
• Troubleshoot complex problems, conduct root‑cause analysis and resolve difficult process engineering issues.
• Create internal documentation, presentations and technical reports for products.
• Communicate with customers to resolve complex process issues under limited supervision.
• Identify, select and partner with vendors and suppliers, and serve as a resource for junior colleagues.

Required profile

• PhD, Master or Bachelor degree in Engineering.
• More than 5 years of process development experience, especially with wet‑clean modules.
• Demonstrated expertise in complex problem solving and innovative thinking.
• Passion for iterative hardware development, testing and learning cycles.

Required skills

• Wet‑clean process development.
• Hardware characterisation.
• Film and surface property measurement.
• Data analysis and root‑cause investigation.