Manager, Process Engineer – Deposition

About the role

Applied Materials is the global leader in materials science and engineering solutions that enable every new semiconductor chip and advanced display. As a Manager, Process Engineer (Deposition) you will lead the development and scaling of next‑generation advanced packaging technologies, working with thin‑film deposition processes to meet critical customer roadmaps.

Key responsibilities

• Lead development and scaling of advanced packaging technologies using PVD, CVD, and ALD processes.
• Drive process and technology roadmap creation for 3D integration and related semiconductor applications.
• Manage engineers in hardware characterization, method definition, and technology implementation.
• Collaborate with customers, research organizations, and cross‑functional teams to resolve high‑value process engineering issues.
• Ensure effective product and technology demonstrations and lead market‑share improvement initiatives.

Required profile

• Comprehensive understanding of semiconductor thin‑film deposition and related job families.
• Deep technical expertise in PVD, CVD, ALD and strong knowledge of materials engineering and process integration.
• Experience with advanced packaging technologies such as TSV, hybrid bonding, and wafer‑level packaging.
• Demonstrated supervisory or management experience with strong communication and influencing skills.
• Problem‑solver attitude with a quality‑mindset.

Required skills

• Physical Vapor Deposition (PVD)
• Chemical Vapor Deposition (CVD)
• Atomic Layer Deposition (ALD)
• Through‑Silicon Via (TSV)
• Hybrid bonding
• Wafer‑level packaging

What we offer

• Supportive work culture that encourages learning, development, and career growth.
• Comprehensive health, wellbeing, and personal‑professional growth programs.
• Full‑time position based at Science Park II (moving to Tampines in April 2027) with 20% travel.
• Relocation assistance and equal‑opportunity employment.