Principal Integration Engineer (Process Integration)

About the role

SSMC, a joint venture between NXP and TSMC offering semiconductor fabrication solutions, is looking for a Principal Engineer to join its Process Integration (TSMC) team. You will manage the integration of all module processes and their derivatives, acting as owner of new tapeout prototype lots and leading technology transfer.

Key responsibilities

• Lead the development, transfer and maintenance of advanced CMOS fabrication technology with good process capability and high yield.
• Manage integration of all module processes and their derivatives, and lead new technology transfer from the mother fab or process development.
• Own new tapeout prototype lots and ensure a 100% success rate.
• Drive process robustness through root cause analysis and collaboration on improvements to meet 100% WAT and Cpk goals; escalate quality concerns and stop at the source.
• Work with product engineering on low-yield product sensitivity and plan product-specific process tuning to meet baseline yield targets.
• Collaborate with Customer Account Management to resolve customer complaints and provide the information needed to satisfy customers.
• Lead a sub-team in cross-functional continuous improvement projects and mentor, coach and train engineers and senior engineers.
• Interact regularly with TSMC mother fabs on integration alignment and benchmarking, and co-work with them on product and technology transfer and electrical characterization.
• Initiate and lead change across process integration, yield and process improvement, and resolve process integration issues for new technologies.

Required profile

• Masters or Bachelor degree in Electrical or Electronic Engineering or equivalent.
• Minimum 6 years of relevant experience in a semiconductor fab environment preferred.
• Strong leadership, motivational ability and ability to lead a technical focus team to resolve issues.
• Comfortable speaking Mandarin, as work involves Mandarin-speaking mother fabs and customers.

Required skills

• Advanced knowledge of CMOS, Flash, Non-Volatile Memory or HV wafer fabrication.
• SPC and 8D problem-solving competence.
• Advise engineering knowledge such as semiconductor device theory, electronics, failure analysis and wafer fabrication processes.
• Proficiency in PROMIS, Klarity ACE and statistical tools (JMP, Minitab) is an added advantage.