Process Engineer Intern

About the role

The Process Engineer Intern will support the development, characterization, and optimization of thin‑film deposition processes for advanced semiconductor packaging. Working closely with process, hardware, and materials engineers, you will conduct experiments, analyze data, and contribute to next‑generation semiconductor technology.

Key responsibilities

• Assist in designing and executing experiments for CVD, PECVD, PEALD and related thin‑film deposition processes.
• Perform wafer processing runs, collect and analyze metrology data, and identify opportunities for performance improvement.
• Characterize film properties such as thickness, uniformity, refractive index, stress, composition, surface roughness and electrical properties.
• Support troubleshooting of process and equipment issues through root‑cause analysis and documentation of corrective actions.
• Maintain accurate experimental records, prepare technical reports and present findings to engineering leadership.

Required profile

• Basic understanding of semiconductor manufacturing and thin‑film deposition techniques.
• Experience with experimental design, statistical analysis and data visualization.
• Strong problem‑solving abilities and effective written and verbal communication skills.
• Ability to work both independently and collaboratively within cross‑functional teams.

Required skills

• CVD, PECVD, PEALD thin‑film deposition.
• Wafer processing and metrology.
• Statistical data analysis and DOE.
• Data visualization tools.
• Film characterization techniques.
• Root‑cause analysis.

What we offer

• Supportive work culture that encourages learning and professional growth.
• Access to cutting‑edge semiconductor manufacturing equipment and technologies.
• Health and wellbeing programs, including personal and professional development resources.