Process Integration Engineer, HBM NPI

About the role

Micron is looking for a Process Integration (PI) Engineer for its Package Development Engineering (PDE) team. The role drives process integration excellence for High Bandwidth (HBM) products during New Product Introduction (NPI), ensuring robust process readiness, yield ramp and cross-module integration across Post Wafer Finishing, assembly and test. It works cross-functionally with Fab, Assembly, Test, Yield, Quality and central engineering teams.

Key responsibilities

• Execute assigned HBM NPI PI tasks following procedures and phase-gate requirements, support NPI builds through lot tracking and data collection, and assist with the NPI-to-High Volume Manufacturing handoff
• Run process characterization, Design of Experiments (DOEs) and window studies, and perform yield, defect and variability analysis
• Support root cause analysis and corrective actions for scoped issues
• Work with Fab, Assembly, Test, Yield and Quality teams, communicate status and risks to senior engineers and escalate issues promptly
• Prepare technical documentation, trackers and summaries, and contribute to NPI, Model of Record and program reviews
• Use AI-assisted tools to improve efficiency and quality, and share AI-enabled improvements with colleagues

Required profile

• Bachelor's or master's degree in engineering or a related discipline
• 0-2 years of relevant experience in semiconductor manufacturing, process or product engineering
• Basic understanding of semiconductor process flows and process integration concepts
• Ability to follow NPI procedures and phase-gate requirements
• Strong analytical, logical and critical thinking skills, effective communication and a growth mindset
• Interest in and knowledge of the semiconductor industry and Micron is preferred; internship or semiconductor industry experience is a plus

Required skills

• Data analysis and basic statistics (Excel)
• JMP or Python preferred
• Baseline digital fluency and role-appropriate AI literacy