Senior Principal Foundry Engineer - HV/BCD Process Integration

About the role

NXP's APAC Central Competence Team works with external foundries to ensure a stable chip supply for its business lines. This role drives the ramp-up of lead products under new technology introduction (NTI) and within foundry process transfers and new fab enablement, based in Singapore.

Key responsibilities

• Collaborate closely with foundries, NXP technology groups, business lines and other stakeholders to qualify and release processes.
• Act as front-end process safe launch owner, working with foundries during ramp-up to drive manufacturability and yield improvement.
• Interface with key customers on critical projects and lead projects to timely completion.
• Make main decisions on process integration, balancing technical judgement, resource planning, project schedule, logistics and supplier relationships.
• Handle NTI process transfers within foundries and with NXP joint ventures.

Required profile

• Bachelor or MSc in physics or electrical engineering.
• More than 10 years of experience in front-end IC process integration, in foundry production or development teams.
• Hands-on experience leading teams on development/transfer projects or production ramp-up.
• Fluency in spoken Mandarin, as the role involves regular interaction with Mandarin-speaking suppliers.

Required skills

• In-depth knowledge of HV/BCD devices and processes.
• Understanding of yield enhancement techniques and data analysis.
• Good communication skills and the ability to influence discussions.
• Proactive, creative, pragmatic and result-driven approach.