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Senior Quantum 3D Integration and Packaging Engineer

amat · Sgp

New
Senior 🇬🇧 English
wafer-level packaging hybrid bonding TSV chiplets flip-chip semiconductor fabrication process integration materials characterization metrology DOE data analysis process optimization root cause analysis quantum devices superconducting technologies photonics cryogenic systems

Job description

About the role

Applied Materials’ CTO group is building solid‑state solutions for quantum technology, focusing on superconducting qubits and optical quantum computing. The team collaborates with system companies and universities to create quantum devices with dramatically lower error rates, leveraging cutting‑edge materials engineering, semiconductor processing, and advanced optics.

Key responsibilities

  • Create 3D integration and packaging solutions for various quantum platforms and structures.
  • Work with advanced packaging, process, hardware, and metrology teams to develop new materials, processes, and structures for quantum devices.
  • Design experiments, collect and analyze data, and compile detailed reports while adhering to safety guidelines.
  • Troubleshoot complex problems, perform root‑cause analysis, and resolve challenging process engineering issues.
  • Generate internal and external documentation, presentations, and technical reports.
  • Stay current with advancements in 3D integration, quantum information, and related fields to continuously improve methodologies.
  • Collaborate with customers, start‑ups, and universities to identify key challenges and develop enabling solutions.

Required profile

  • PhD, Master’s or Bachelor’s degree in Materials Science, Electrical Engineering, Physics, Microelectronics or a related field.
  • 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.
  • Strong problem‑solving, technical communication, and cross‑functional collaboration skills.
  • Ability to work effectively with customers, start‑ups, universities, and multidisciplinary R&D teams.

Required skills

  • Wafer‑level packaging, hybrid bonding, TSV, chiplets, flip‑chip technologies.
  • Semiconductor fabrication, process integration, materials characterization, metrology.
  • Design of Experiments (DOE), data analysis, process optimization, root‑cause analysis.
  • Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems (strong plus).

What we offer

  • Supportive work culture that encourages learning, development, and career growth.
  • Opportunities to work on cutting‑edge quantum and semiconductor technologies with globally recognized R&D teams.
  • Comprehensive health, wellbeing, and professional development programs.

Questions fréquentes

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Cliquez sur "Postuler maintenant" en haut de la page. Vous pouvez importer votre CV en 1 clic — Jobiglo extrait automatiquement vos informations et postule pour vous.
Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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amat

Sgp