Service & Application Engineer – Semiconductor

About the role

We are looking for a Service & Application Engineer to join our semiconductor manufacturing team in Science Park, Singapore. The role focuses on supporting customers with technical solutions for front‑of‑line equipment, especially wire bonding systems, and ensuring successful project execution.

Key responsibilities

• Provide technical support for project and application design proposals.
• Apply analytical problem‑solving skills to meet tight timelines and resolve challenging issues.
• Participate in internal and external meetings to define specifications for project execution.
• Coordinate between sales/marketing and technical service teams to satisfy customer requirements.
• Support pre‑sales technical discussions and presentations, aligning on cost and schedule estimates.
• Maintain hands‑on knowledge of semiconductor front‑of‑line equipment, with a focus on wire bonders (gold, copper, aluminium).

Required profile

• Diploma or degree in Engineering.
• Minimum 3 years of relevant experience, preferably with wire bonders and semiconductor assembly.
• Strong technical knowledge of front‑of‑line assembly processes.
• Willingness to travel occasionally within the Asia‑Pacific region.

Required skills

• Wire bonders (gold, copper, aluminium).
• Semiconductor front‑of‑line equipment.
• Analytical problem‑solving.

What we offer

• Competitive salary ranging from SGD 4,500 to SGD 6,000 per month.
• Variable bonus and annual wage supplement.
• Permanent employment with opportunities for professional growth.