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Technical Director, Advanced Packaging Integration

amat · Sgp

New
Senior 🇬🇧 English
JMP DoE Failure analysis Metrology Lithography Dry etch Thin film deposition

Job description

About the role

Applied Materials is seeking a highly skilled Advanced Packaging Technical Director to join its Disruptive Technology Pathfinding team within the Advanced Packaging division. The role focuses on advanced packaging process integration, with emphasis on materials and process development and seamless integration across manufacturing processes on large form factor substrates. It leads and develops complex technology and engineering development projects.

Key responsibilities

  • Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures and technologies
  • Define, document and implement end-to-end process flows for panel-level packaging technologies
  • Lead material selection, characterization and compatibility assessments for large form factor substrates
  • Partner with customers to define process specifications and acceptance criteria
  • Work with business units on process development (lithography, etch, thin films), module co-optimization and technology transfer
  • Provide feedback to business unit leaders on process and hardware enhancements needed to meet customer roadmaps
  • Analyze process data to drive optimization and improvement
  • Run root-cause analyses of defects and implement corrective actions to improve yield and reliability
  • Design and run complex engineering experiments within safety guidelines, and publish and present findings at industry conferences and in peer-reviewed journals
  • Mentor early-career engineers and provide technical direction

Required profile

  • Master's degree with 10 years of experience, or PhD with 5 years of experience, in Electrical Engineering, Materials Science, Chemical Engineering or a related field
  • Hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), organic interposers and wafer-level back-end technologies
  • Proven ability to lead multi-functional teams and communicate clearly at executive level

Required skills

  • Process equipment and materials knowledge, including trade-offs and selection criteria
  • Statistical data analysis (DoE, JMP)
  • Process characterization, metrology, materials and failure analysis
  • Reliability requirements and qualification methodologies

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Source : ats:workday

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Published 3 hours ago

Expires 1 month from now

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amat

Sgp