Wafer Fab Process Engineer

About the role

We are looking for a Wafer Fab Process Engineer to lead process development, optimisation and transfer to manufacturing, ensuring yield, quality, cost and reliability targets are met. The role involves ownership of advanced process modules and driving yield improvement initiatives across our semiconductor fab.

Key responsibilities

• Own and drive advanced process modules (thin film deposition – metal/passivation, wafer thinning, thermal – oxidation, diffusion, implantation).
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and process transfer to high‑volume manufacturing.
• Perform root cause analysis and implement robust corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate cross‑functionally with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Required profile

• Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
• At least 5 years of semiconductor wafer fab process experience in thin film deposition – metal/passivation and/or thermal – oxidation, diffusion, implantation.
• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
• Demonstrated leadership in cross‑functional technical projects.

Required skills

• Thin film deposition (metal/passivation)
• Wafer thinning
• Thermal oxidation, diffusion, implantation
• Statistical Process Control (SPC)
• Design of Experiments (DOE)
• Failure Mode and Effects Analysis (FMEA)
• Statistical data analysis
• Six Sigma (Green/Black Belt)