Director, Advanced Packaging Disruptive Technology

About the role

Based in Singapore, the Director will define and drive the long‑range strategy for next‑generation advanced packaging technologies, leading disruptive innovation that shapes future integration architectures. The role sits at the intersection of technology disruption, customer insight, and ecosystem co‑innovation.

Key responsibilities

• Define and execute a N+2 and beyond roadmap for advanced packaging, identifying inflection points in integration, interconnect, materials, and architectures.
• Build and lead a high‑impact pathfinding team, establishing frameworks for idea generation, rapid prototyping, and down‑selection.
• Translate customer roadmaps and market trends into actionable technology development strategies.
• Develop and manage strategic partnerships across materials suppliers, OSATs, foundries, and research institutions.

Required profile

• 15+ years of experience in semiconductor technology, including advanced packaging or related domains.
• Proven leadership in technology pathfinding, innovation strategy, or early‑stage platform development.
• Experience building and leading cross‑functional exploratory R&D teams.

Required skills

• D2W
• RDL
• CoWoS
• TSV
• Advanced packaging technologies
• Semiconductor technology

What we offer

• Supportive work culture that encourages learning, development, and career growth.
• Comprehensive health and wellbeing programs and benefits.
• Opportunities to work on cutting‑edge material science and engineering challenges.