Intern – Metrology, Defect Inspection & Data Analytics

About the role

The intern will support the development and validation of overlay metrology and defect inspection applications for a die‑to‑wafer hybrid bonding cluster system. The role involves engineering data analysis, image processing, and development of software utilities to improve measurement, inspection, and workflow efficiency. Applied Materials is the global leader in materials science and engineering solutions that underpin virtually every new semiconductor chip and advanced display. The internship offers a supportive work culture that encourages learning, development, and growth. This is a full‑time internship located in Singapore with no travel or relocation required.

Key responsibilities

• Support metrology and defect inspection application development and testing.
• Analyze measurement and inspection data to evaluate system performance.
• Develop scripts and software tools for data processing, visualization, and automation.
• Apply image processing techniques for defect analysis and characterization.
• Prepare technical reports and collaborate with cross‑functional engineering teams.

Required skills

• Image processing
• Data analysis
• Software development and scripting