Process Engineer Intern - 3DIC Thin Film Deposition

About the role

Applied Materials is hiring a Process Engineer Intern in Singapore to support the development, characterization and optimization of thin film deposition processes for advanced semiconductor packaging. The intern works closely with process, hardware and materials engineers to run experiments, analyse data and help develop new technology for next-generation semiconductor devices. The position is full time, with no travel and no relocation.

Key responsibilities

• Design and run process engineering experiments and perform wafer processing runs according to defined procedures
• Support development and optimization of CVD, PECVD, PEALD or related thin film deposition processes
• Analyze process results and identify opportunities for performance improvement
• Collect and analyze process and metrology data, characterizing film thickness, uniformity, refractive index, stress, composition, surface roughness and electrical properties
• Use statistical methods and data visualization tools to find trends and correlations
• Run film characterization and integration tests on an internal test vehicle
• Support troubleshooting and root cause analysis, document findings and propose corrective actions
• Maintain experimental records and engineering logs, prepare technical reports and present results to engineering leadership
• Collaborate with Process, Hardware, Manufacturing and Product Engineering teams and support customer-focused development

Preferred qualifications

• Knowledge of semiconductor manufacturing processes
• Basic understanding of thin film deposition, plasma processing or surface science
• Experience with experimental design and data analysis
• Strong problem-solving and analytical skills, and effective written and verbal communication

Depending on business priorities, interns may work on low-temperature dielectric deposition, advanced packaging materials, wafer bonding, gap fill, film characterization, process hardware characterization, process automation, data analytics or AI-assisted process optimization. By the end of the internship, candidates gain experience in process development methodology, advanced packaging, DOE execution, thin film characterization, root cause analysis and technical presentation.