Process Engineering Manager – Electroplating

About the role

Applied Materials is looking for a Process Engineering Manager to lead electroplating development for advanced semiconductor packaging. Based in Singapore, you will head a team of engineers, drive technology innovation, and work closely with global customers and cross‑functional groups.

Key responsibilities

• Lead and mentor engineers in hardware characterization, method development, and technology transfer for a full product portfolio.
• Plan, execute, and manage process‑engineering projects, from concept through qualification, for advanced packaging applications.
• Collaborate with key customers to resolve complex electroplating issues and ensure successful product integration.
• Develop and implement new electroplating technologies, analytical instrumentation, and process‑optimization methodologies.
• Produce technical documentation, specifications, and presentations for internal and external stakeholders.

Required profile

• 8+ years of semiconductor process‑engineering experience with hands‑on electroplating/electrochemical deposition.
• Proven track record leading R&D projects, technology innovation, and product qualification.
• Strong people‑leadership skills with experience mentoring engineering teams.
• Excellent communication abilities for technical reporting and executive presentations.

Required skills

• Electroplating and electrochemical deposition
• Copper plating, wafer‑level packaging, RDL, copper pillars, TSVs
• Advanced packaging processes
• Design of Experiments (DOE) and statistical analysis
• Root cause analysis and process optimization

What we offer

• Supportive work culture that encourages learning, development, and career growth.
• Health and wellbeing programs, including personal and professional support.
• Opportunities to work on cutting‑edge semiconductor technologies in a global leader.