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PYE Failure Analysis Engineer (NAND Engineering)

micron · Msb

New
Mid 🇬🇧 English
Fault isolation Physical failure analysis Electrical device characterization NAND/DRAM/HBM devices

Job description

About the role

Micron Technology is looking for a NAND Engineering-Product Yield Enhancement (PYE) Failure Analysis (FA) Engineer to join its PYE team. The role provides full Fault Isolation (FI) and electrical failure analysis support for product qualifications, new device introductions and the latest Micron technologies, working closely with Product Engineering teams to isolate electrical failures.

Key responsibilities

  • Perform sophisticated electrical device characterization to determine electrical fail mechanisms.
  • Operate fault isolation equipment to narrow down failure defect locations.
  • Establish and hypothesize electrical or process fail mechanisms from detailed electrical fail models and physical failure analysis characterization, supporting process improvement.
  • Collaborate with teams from frontend to backend and the Global Quality department to resolve defectivity issues.
  • Prepare and present electrical and physical failure mechanisms weekly to drive continuous improvement.
  • Develop and implement new fault isolation and physical failure analysis techniques.
  • Coordinate the maintenance and high uptime of fault isolation and physical failure analysis tools.
  • Integrate AI-assisted tools and insights into daily work and share AI-enabled improvements.

Required profile

  • Bachelor's or Master's degree in Electrical/Electronic Engineering, Electrical, Microelectronics or Data Science.
  • Proven experience as a team player with strong analytical and problem-solving skills.
  • Excellent communication skills, able to present complex information in large meetings.
  • Flexibility to take part in planned shift rotations for product qualifications, manufacturing events and technology ramp activities.

Required skills

  • Knowledge of fault isolation equipment, techniques and physical failure analysis is a significant advantage.
  • Strong understanding of NAND/DRAM/HBM devices and knowledge of fab processes is desirable.
  • Experience or strong interest in AI, machine learning, data analytics or automation applied to semiconductor engineering, manufacturing, failure analysis or yield enhancement is highly desirable.

Questions fréquentes

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Msb