Research Fellow (Flexible Electronics)

About the role

The School of Materials Science and Engineering (MSE) at NTU is seeking a highly motivated, interdisciplinary Research Fellow to develop soft, stretchable interconnect technologies for next-generation stretchable and flexible electronic devices. The role covers the design, fabrication and reliability of conductive interconnects and bonded interfaces on soft, deformable substrates, with emphasis on printable conductive materials, low-temperature and photonic sintering/bonding, interfacial reaction and diffusion mechanisms, and electromechanical reliability under repeated deformation.

Key responsibilities

• Design, fabricate and characterise stretchable and flexible interconnects and bonded joints on soft substrates using printable conductive materials and low-temperature/photonic bonding and sintering methods.
• Develop conductive inks, nanoparticle and composite material systems, and interlayer/interface designs for reliable soft interconnection and device integration.
• Conduct microstructural, chemical, mechanical and electromechanical characterisation, including electrical and reliability evaluation under bending, stretching and cyclic deformation.
• Collaborate with interdisciplinary researchers to integrate soft-interconnect solutions into stretchable electronic devices, sensors and system-level platforms.
• Assist in manuscript preparation, conference presentations, grant development and reporting to funding agencies and collaborators.
• Mentor junior researchers and students where required, and support laboratory management, procurement and equipment coordination where required.

Required profile

• PhD in Materials Science, Electronic/Electrical Engineering, Mechanical Engineering, Microelectronics, Chemistry or a related discipline.
• Demonstrated research experience in flexible/stretchable electronics interconnection, printed electronics, conductive inks, soldering, interfacial joining or low-temperature bonding of advanced materials.
• Strong background in interfacial and interconnect engineering, joint/interface design and characterisation of bonded and printed interfaces on rigid or soft substrates.
• Strong publication record in reputable journals and the ability to drive research tasks to completion.
• Good written and oral communication skills and ability to work in a multidisciplinary, collaborative research environment.

Required skills

• Familiarity with microstructural, chemical, mechanical and electrical/electromechanical characterisation methods for materials and interfaces.
• Highly desirable: conductive ink formulation and printing, photonic/pulsed-light or low-temperature sintering, nanoparticle/nanocomposite conductive materials, flexible/stretchable device fabrication, electronic/advanced packaging, interfacial reaction and diffusion, and microstructure-property-reliability relationships in interconnects.