Senior Engineer, Process Integration, NAND NTI

About the role

Micron Technology is hiring a NAND Module Process Integration Engineer in its Singapore R&D department. You will design, develop, integrate and implement process solutions that improve the yield and quality of next-generation 3D NAND products, with competitive cost and performance within the required timeline.

Key responsibilities

• Identify and quantify key module deficiencies and technology gaps, lead cross-functional teams to address them, and improve process flows and manufacturability
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability
• Coordinate activities at the manufacturing site to secure funding for experiments and conversions, and communicate decisions to R&D, Product Engineering and Manufacturing partners
• Run development projects evaluating new integration schemes for alpha and derivative part types, and establish proof of concept for future tech nodes at the manufacturing facility
• Lead quarterly yield summits and monthly program reviews, summarizing complex problems and aligning R&D, Manufacturing and senior management
• Assist transferring new technology from R&D to manufacturing, including documentation and training of module fundamentals
• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality and effectiveness

Required profile

• Passion for semiconductor technology and innovation
• Adept at data analysis, problem-solving and process integration optimization
• Excellent communication skills and ability to work in cross-functional teams
• Preferred: PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering or a related field
• Preferred: 2 years of experience in the semiconductor industry

Required skills

• Desirable: proficiency in data analysis, visualization or simulation software such as JMP or Tableau
• Desirable: end-to-end understanding of PI modules on new NAND technologies and structural and electrical fail mechanisms
• Desirable: in-depth knowledge of non-volatile memories (NAND), the NAND process flow, process-device interaction, and common yield and reliability issues
• Desirable: experience in the semiconductor R&D product life cycle from design to manufacturing