Senior Field Product Readiness Engineer

About the role

The Field Product Readiness Engineer IV leads service product readiness execution for complex semiconductor equipment across Etch, MDP, or DDP product lines. Based in Singapore, the role bridges field observations, tool data, and customer impact to drive actionable recommendations and ensure smooth transitions from early readiness activities through NPI and high‑volume manufacturing.

Key responsibilities

• Lead readiness validation for complex products, new modules, or multi‑site streams, covering documentation, tooling, training, spare strategy, and AIx readiness.
• Drive closure of cross‑functional readiness gaps before field introduction, ensuring traceability between readiness criteria and field risks.
• Coordinate first‑install and readiness execution across local or regional teams, capturing lessons learned and updating installation, PM, CM, and training materials.
• Validate and improve CE tooling, jigs, install procedures, and control plans; frame technical problems with data and recommend next steps.
• Develop out‑of‑control action plans, use FMECA learning to drive systemic fixes, and manage sprint planning, backlog quality, and KPI tracking.

Required profile

• 7‑10 years hands‑on experience with Etch, MDP‑Metal Deposition, or DDP‑Dielectric Deposition products.
• Deep expertise in product readiness, serviceability, and product introduction, with proven ability to lead functional projects.
• Strong system‑level understanding of semiconductor equipment and fab operations.
• Excellent problem‑solving skills using multiple data sources, field evidence, and customer context.
• Bachelor’s degree in mechanical, electrical, materials, chemical, industrial, automation engineering, or related discipline.

Required skills

• Etch
• MDP (Metal Deposition)
• DDP (Dielectric Deposition)
• AIx digital solutions
• FMECA analysis
• KPI tracking
• Sprint execution