Senior Integration Lead - Advanced Packaging 3DHi and 2.5D

About the role

The CMOS product team at GlobalFoundries is looking for a Singapore-based Senior Advanced Packaging 3DHi and 2.5D Integration Lead to join its local technology development organization. The lead defines and drives advanced packaging technology development from architecture and early process demonstration through qualification, manufacturing transfer and production readiness. The role requires ownership of integration architecture, test-site and qualification-vehicle definition, and electrical, thermal, mechanical, reliability, yield and manufacturability validation.

Key responsibilities

• Serve as lead integrator for complex 3DHi and 2.5D technology programs, turning customer product requirements into integration architectures, qualification strategies and technology roadmaps.
• Define end-to-end process flows for chiplet-based 2.5D and 3DHi solutions, including silicon interposers or bridges, TSVs, redistribution layers, wafer thinning, micro-bump or hybrid-bond interfaces, and die-to-wafer and wafer-to-wafer assembly.
• Own trade-off analysis across electrical performance, power delivery, signal integrity, thermal management, mechanical stress, warpage, reliability, yield, cost and manufacturability.
• Define test-site requirements and lead development of test structures, interposer and package vehicles, daisy chains, reliability structures and electrical test methodologies.
• Establish process control, in-line inspection, metrology, defectivity, known-good-die, assembly and qualification strategies.
• Identify integration gaps and failure mechanisms, run structured DOEs and drive root-cause analysis and process-window optimization.
• Analyze electrical, physical, thermal, mechanical, defectivity, reliability and yield data to define corrective actions.
• Lead cross-functional execution from concept and design-rule alignment through milestone reviews, qualification readiness, process freeze, supply-chain alignment and manufacturing transfer.
• Communicate program status, risks and trade-offs to management, customers and global teams, and build relationships across Singapore and worldwide teams.

Required profile

• Bachelor's degree or higher in Electrical, Materials, Mechanical, Chemical Engineering, Physics or a related field.
• Relevant experience in advanced semiconductor packaging, process integration, assembly or heterogeneous integration: B.S. with 10 years, M.S. with 7 years, or Ph.D. with 5 years.
• Hands-on experience leading 3DHi and/or 2.5D integration, including chiplets, interposers, TSVs, redistribution layers, hybrid bonding, bonding, wafer thinning and package qualification.
• Experience with test vehicles, DOEs, process windows, metrology, reliability qualification, failure analysis, yield improvement and manufacturing transfer.
• Technical leadership, programme ownership and cross-functional execution across global sites and partners.
• English communication skills and willingness to work on site in Singapore; relocation is preferred.

Preferred qualifications

• Advanced degree in a relevant engineering or science discipline.
• Experience in Singapore's semiconductor ecosystem (wafer fab, foundry, OSAT, equipment or materials supplier, research institute).
• Working knowledge of 2.5D/3D design enablement, co-design, interconnect density, signal and power integrity, thermal and mechanical modelling, design rules and assembly tolerances.
• Proven leadership in complex technology programmes and manufacturing hand-off in high volume.