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Senior Member of Technical Staff – Advanced Packaging Pathfinding

amat · Sgp

Senior 🇬🇧 English
Heterogeneous integration Chiplet architectures Simulation Experimental validation

Job description

About the role

Applied Materials is seeking a senior individual contributor to lead pathfinding and early‑stage technology development for next‑generation advanced packaging architectures. The role focuses on disruptive innovation, deep technical problem‑solving and translating concepts into feasible solutions that align with the company’s long‑term strategy.

Key responsibilities

  • Drive long‑range (N+2 and beyond) pathfinding in advanced packaging, identifying critical inflection points in interconnect scaling, materials and integration architectures.
  • Lead hands‑on feasibility studies for novel packaging concepts such as D2W, RDL, CoWoS, TSV and heterogeneous integration schemes.
  • Develop and validate new integration approaches, perform technical trade‑off analyses and contribute to make/buy/partner evaluations.
  • Design and execute experiments, simulations and test vehicles to reduce technical risk and create scaling frameworks.
  • Engage with customers, ecosystem partners and internal stakeholders to align technical solutions with market trends and roadmap requirements.

Required profile

  • 10–15+ years of semiconductor experience with strong exposure to advanced packaging, process integration or related domains.
  • Demonstrated track record in technology development, pathfinding or exploratory R&D.
  • Advanced degree (MS/PhD) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics or related field is preferred.
  • Evidence of innovation through patents, publications or first‑of‑its‑kind solutions.

Required skills

  • Advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, mixed interconnect architectures).
  • Heterogeneous integration and chiplet architecture expertise.
  • Design‑process co‑optimization, simulation and experimental validation.
  • Technical trade‑off analysis, modeling and scaling framework development.

What we offer

  • Location in Singapore’s Science Park II with a move to Tampines in Dec 2026.
  • Supportive work culture that encourages learning, development and career growth.
  • Comprehensive health, wellbeing and employee benefit programs.

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Source : ats:workday

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Published 1 week ago

Expires 1 month from now

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amat

Sgp