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Senior Member of Technical Staff - Advanced Packaging Pathfinding

amat · Sgp

New
Senior 🇬🇧 English
RDL TSV CoWoS Hybrid bonding Heterogeneous integration Chiplet architectures

Job description

About the role

Applied Materials is hiring a Senior Member of Technical Staff (SMTS) in its Advanced Packaging Pathfinding team in Singapore. The role drives pathfinding and early-stage technology development for N+2 and beyond advanced packaging architectures, focusing on disruptive innovation, deep technical problem-solving and concept-to-feasibility execution. It sits at the intersection of technology innovation, customer roadmaps and ecosystem collaboration.

Key responsibilities

  • Drive long-range pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials and integration architectures.
  • Lead hands-on development and feasibility studies for concepts such as D2W, RDL, CoWoS, TSV and heterogeneous integration, and validate new integration approaches.
  • Perform technical analysis and trade-off assessments, and contribute to make/buy/partner evaluations.
  • Design and run experiments, simulations and test vehicles, and develop scaling frameworks and design-process co-optimization strategies.
  • Document findings and communicate them to influence technology roadmap decisions.
  • Translate customer requirements (AI, HPC, memory integration, chiplets) into technical problems and propose novel solutions.
  • Collaborate with materials suppliers, equipment teams, OSATs, foundries and research partners, and mentor junior engineers.

Required profile

  • 10-15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration or related domains.
  • Demonstrated experience in technology development, pathfinding or exploratory R&D.
  • Strong understanding of advanced packaging technologies (RDL, TSV, CoWoS, hybrid bonding, etc.).
  • Preferred: advanced degree (MS/PhD) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics or a related field; experience in heterogeneous integration, chiplet architectures or next-generation interconnects; patents, publications or first-of-a-kind solutions.

What we offer

  • Supportive work culture focused on learning, development and career growth.
  • Full-time regular position based at Science Park II (moving to Tampines in December 2026).
  • 20% travel time; relocation eligible.

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Source : ats:workday

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Published 12 hours ago

Expires 1 month from now

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amat

Sgp