Senior Packaging Designer

About the role

The Packaging Designer is responsible for product and tooling design, focusing on advanced semiconductor packaging technologies. Candidates with experience in wafer bumping, WLCSP, BGA or fan‑out processes are encouraged to apply.

Key responsibilities

• Generate, update, and revise electrical routing layouts based on netlists or external designs.
• Create test vehicle designs and associated PCB layouts.
• Prepare design risk assessment reports aligned with fan‑in/fan‑out capabilities.
• Develop reticle and stencil designs.
• Produce additional schematics or drawings as requested.
• Review, maintain, and update internal design guidelines.
• Manage conversion of internal designs into supplier‑ready final designs.
• Document all drawing revisions and change records.
• Support internal and external audits and perform ad‑hoc duties.

Required profile

• Master’s degree in Electrical Engineering or a related field, or a Bachelor’s degree with 5‑10 years of relevant experience.
• Strong understanding of design guidelines and risk assessment for fan‑in/fan‑out processes.
• Experience with wafer‑level processes such as wafer bumping, WLCSP, BGA, eWLB, or similar.
• Hands‑on experience in PCB test board design is a plus.
• Ability to work collaboratively with internal and external customers.

Required skills

• Cadence APD for RDL routing and mask design.
• Linkcad.
• CAM350.
• AutoCAD.
• GDS editors.
• Gerber editors.
• Knowledge of wafer bumping, WLCSP, BGA, eWLB and other fan‑out technologies.
• PCB test board design.