Senior Process Development Engineer – Wet Etch (NTI)

About the role

Micron Semiconductor Asia Operations is seeking a Senior Engineer to lead wet‑etch process development for next‑generation NAND technologies. You will work within a global TD team, integrating innovative solutions to improve yield, quality, and process margins.

Key responsibilities

• Develop and optimise unit processes to meet yield and quality targets for advanced NAND parts.
• Quantify benefits of new process or equipment solutions and drive early adoption.
• Prioritise critical technology challenges for the Singapore‑based Wet Etch team.
• Collaborate with cross‑functional teams to troubleshoot and improve processes.
• Partner with Boise TD Wet Etch peers on technology choices for upcoming nodes.
• Conduct fundamental research, hardware evaluations, and generate IP relevant to Micron.
• Design and implement advanced process monitoring and control methodologies.
• Lead multi‑disciplinary projects focused on quality, yield, cost, and productivity improvements.
• Integrate AI‑assisted tools to enhance efficiency and drive continuous improvement.

Required profile

• Masters or PhD in Chemistry, Materials Science, Chemical Engineering or Micro‑electronic Engineering.
• 2‑3 years of experience in the semiconductor industry, preferably in wet‑etch or process development.
• Strong analytical and problem‑solving abilities with a focus on innovation.

Required skills

• Wet Etch process development
• Semiconductor manufacturing
• AI‑assisted tools and digital fluency
• Process monitoring and control
• Hardware evaluation and experimental design