Staff Process Technology Integration Engineer

About the role

AMD is hiring a Staff Process Technology Integration Engineer in Singapore. You will interface with the HBM (High Bandwidth Memory DRAM) vendor's teams to drive resolution of silicon manufacturing issues affecting yield, reliability or performance of HBM in AMD's AI products. The role can also cover yield, reliability or performance of AMD-designed processor chips at wafer fabrication foundries, working closely with the silicon vendor and global AMD teams.

Key responsibilities

• Provide expertise in process and integration for advanced front/middle/back end-of-line modules, for both HBM/DRAM and logic process flows.
• Review systematic defect and parametric signatures with the HBM vendor or silicon foundry and oversee F/M/BEOL issues across products and technology nodes.
• Jointly design and analyse process improvement (CIP/BKM) evaluations at the vendor, and give technical assessment for AMD's process change review board.
• Analyse hardbin, softbin and parametric yield data, and foundry WAT and electrical test parameters, covering both HBM and logic test flows.
• Work with device analysis teams to understand structural and parametric fail mechanisms and deduce process failure causes.
• Interface with supplier quality and reliability teams, providing inputs for material review boards and assessing root causes of reliability and HTOL failures.
• Maintain the F/M/BEOL technology encyclopedia, including failure analysis, defect Pareto charts, process change history and speculative flows.
• Stay up to date on wafer fab process integration trends, unit processes, materials, equipment and competitive teardowns.

Required profile

• Bachelor's, Master's or PhD in a technical field such as Electrical Engineering, Chemical Engineering, Materials Science and Engineering or Physics/Chemistry.
• Professional experience in the semiconductor industry across multiple technology nodes.
• Experience with advanced HBM/DRAM fabrication or FinFET nodes; direct experience in both memory and logic products is highly valued.
• Hands-on experience in unit process modules and/or process integration (FEOL, MEOL or BEOL).
• Strong communication skills to influence stakeholders across time zones.

Required skills

• Understanding of basic process flows for memory and logic products.
• PFA and FI techniques used in device analysis, including deducing fail mechanisms.