Staff/Principal Engineer - CMP Advanced NAND

About the role

Micron is hiring a Staff/Principal Engineer for its next-generation NAND research and development dry etch team, working on CMP (chemical mechanical planarization) process development for 3D NAND. The engineer works directly with process integration and areas such as wet etch, CVD, diffusion, metals, lithography and dry etch, owns the process roadmap and drives innovation, collaboration and testing of new dimensions and scaling.

Key responsibilities

• Develop and optimize CMP procedures to improve product quality and reliability for Micron's memory parts, and understand the process margins needed for mature yield on 3D NAND.
• Carry out fundamental research, consumables development and hardware evaluation, and run experiments to widen process margins and evaluate manufacturability of next-node solutions.
• Collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3D NAND nodes, incorporating best-known manufacturing methods into early development.
• Design and implement advanced process monitoring and control methodologies, and provide a strategic roadmap for N+, N++ and future NAND nodes.
• Act as a technical expert on process, procedure and equipment improvements, lead complex multi-functional projects, advise management on major technical issues, and contribute to patents and technical papers.
• Mentor new hires and less experienced colleagues, engage with procurement and operations teams, and lead quality, yield, cost and productivity improvement meetings.
• Use AI-assisted tools to improve efficiency and quality, and share AI-enabled improvements with the team.

Required profile

• PhD with at least 5 years, or Master's with at least 7 years, or Bachelor's with at least 10 years of relevant experience in electrical engineering, materials science, chemical engineering, physics or a related field, with semiconductor experience.
• Experience in CMP process development on 300 mm wafers, including 3D NAND or other memory technology.
• Strong interest in data science, modelling and adoption of AI to optimize workflows.
• Excellent oral and written communication, collaboration, self-driven and adaptable, with proven mentoring and project management skills.

Required skills

• Hands-on experience operating CMP equipment such as AMAT LKP, EBARA-300X and next-generation CMP tools.
• Optical metrology, profilometry, polishing slurries, conditioners and polishing pads.
• Understanding of dielectric and metal CMP, and of the process flow for planar and vertical NAND memory.