Technical Director, Advanced Packaging Integration

About the role

Applied Materials is seeking a Technical Director to lead advanced packaging process integration for large‑form‑factor substrates. The role drives end‑to‑end technology development, material selection and cross‑functional collaboration to enable next‑generation 2.xD packaging solutions.

Key responsibilities

• Lead cross‑functional teams to develop and enable next‑generation 2.xD packaging concepts, architectures and technologies.
• Define, document and implement end‑to‑end process flows for panel‑level packaging technologies.
• Lead material selection, characterization and compatibility assessments for large form‑factor substrates.
• Partner with customers to define process specifications, acceptance criteria and technology transfer.
• Collaborate with business units on lithography, etch, thin‑film processes and module co‑optimization.
• Analyze process data, drive optimization, conduct root‑cause analyses and implement corrective actions to improve yield and reliability.
• Design and execute complex engineering experiments, collect and analyze data, and deliver rigorous technical reports.
• Publish and present findings at industry conferences and in peer‑reviewed journals.

Required profile

• Master’s degree with 10 years or PhD with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering or related field.
• In‑depth knowledge of advanced 2.xD packaging technologies such as fan‑out panel‑level packaging, organic interposers and wafer‑level back‑end processes.
• Strong understanding of semiconductor processing (lithography, dry etch, thin‑film deposition) and equipment interactions.
• Proven ability to lead multi‑functional teams and drive complex technical projects.
• Excellent written and verbal communication skills for technical presentations and executive‑level discussions.

Required skills

• Advanced 2.xD packaging technologies (FOPLP, organic interposer, substrate and wafer‑level back‑end).
• Semiconductor process integration: lithography, dry etch, thin‑film deposition, materials modification.
• Statistical data analysis and Design of Experiments (DoE) using tools such as JMP.
• Process characterization, metrology, failure analysis and reliability qualification methodologies.
• Root‑cause analysis and yield improvement techniques.

What we offer

• Supportive work culture that encourages learning, development and career growth.
• Opportunities to work on cutting‑edge materials science and engineering solutions that drive AI and next‑generation semiconductor chips.
• Comprehensive health, wellbeing and employee benefit programs.
• Global exposure with collaboration across geographies and time zones.