Technology Development Engineer – Hybrid Bonding & Advanced Packaging Internship

About the role

Applied Materials, a global leader in materials science and engineering solutions, is seeking an intern to support advanced packaging technology development. The internship focuses on hybrid bonding, redistribution layers, damascene copper structures, and wafer‑level interconnects, providing hands‑on exposure to semiconductor fabrication and integration challenges.

Key responsibilities

• Develop and refine process flows for chip‑to‑wafer and wafer‑to‑wafer hybrid bonding applications.
• Design and execute experiments, collect data, and perform statistical analysis.
• Characterize defects and correlate process parameters with electrical and physical performance metrics.
• Support the Process Integration team in creating and testing test vehicles for advanced packaging.

Required profile

• Demonstrate a solid understanding of advanced packaging technology and process integration principles by the end of the internship.
• Contribute effectively to ongoing R&D projects that target next‑generation semiconductor packaging solutions.

Required skills

• Knowledge of redistribution layers (RDL) and damascene copper structures.
• Familiarity with wafer‑level interconnects and hybrid bonding processes.
• Experience with process flow development, experimental design, and data analysis.
• Ability to perform defect characterization and statistical data analysis.
• Understanding of semiconductor fabrication processes.