Technology Development Process Engineer – Hybrid Bonding & Advanced Packaging

About the role

As a Technology Development Process Engineer you will lead the development and integration of hybrid bonding and advanced packaging solutions for logic, memory and 3‑D heterogeneous integration. You will work closely with R&D, equipment, materials and metrology teams to translate customer requirements into qualified manufacturing processes.

Key responsibilities

• Develop and optimize end‑to‑end hybrid bonding processes, including wafer/die surface preparation, cleaning, plasma activation, dielectric‑to‑dielectric and Cu‑Cu direct bonding, and post‑bond annealing.
• Design and execute DOE studies to define process windows, improve bond strength, reduce void density and control overlay accuracy.
• Investigate and resolve integration challenges such as CMP surface topography, surface chemistry, contamination, thermal budget and wafer warpage through data‑driven root‑cause analysis.
• Collaborate with equipment, materials, metrology and integration teams to scale die‑to‑wafer hybrid bonding for HBM, logic and 3‑D heterogeneous technologies.
• Define and implement characterization methods using optical inspection, IR imaging, SEM, AFM, XPS, contact‑angle, electrical testing and reliability evaluation.
• Engage customers, research institutes and ecosystem partners on joint technology development projects and generate technical reports, patents and roadmaps.

Required profile

• Bachelor’s, Master’s or PhD in Engineering, Materials Science, Physics or related field.
• Minimum 5 years of semiconductor experience in technology development, process integration or advanced packaging.
• Hands‑on experience with hybrid bonding, CMP, plasma processing, wet cleaning, TSV integration or process integration.

Required skills

• Hybrid bonding mechanisms and package integration flows.
• Design of experiments (DOE) and statistical analysis tools such as JMP or Minitab.
• Reliability testing, failure analysis and advanced metrology techniques (optical inspection, IR imaging, SEM, AFM, XPS, contact‑angle measurement, electrical test).