Yield Enhancement Engineer

About the role

The Yield Enhancement Engineer will work closely with module engineers to control defect excursions and drive yield improvement initiatives across 24/7 inline operations. This role involves supervising associate engineers, conducting failure analysis, and ensuring wafer quality meets product specifications.

Key responsibilities

• Supervise YE Associate Engineers and wafer tech operators to ensure smooth 24/7 inline shift operations.
• Train and certify associate engineers on recipe creation and defect source knowledge.
• Maintain and enhance internal SOP/OCAP and support internal/external audits.
• Operate FIB, SEM, EDX, and optical microscopy for inline failure analysis.
• Create and manage recipes in Brightfield, Darkfield, and other defect inspection tools.
• Perform partition analysis, defect source tracking, and detailed reporting.
• Build and maintain a defect source library and track defect performance by layer/process/tool.
• Conduct killer ratio analysis and defect characterization across process tools.
• Lead continuous improvement activities with modules, vendors, and equipment teams.
• Liaise with process engineers to troubleshoot inline defects and support low‑yield investigations.
• Automate daily activities to accelerate troubleshooting.
• Authority to stop shipment and production to correct quality problems.

Required profile

• Master’s or degree in Electrical/Electronic Engineering, Material Science, Chemical Engineering, or Physics.
• 2–5 years of fab experience in high‑volume semiconductor manufacturing.
• Strong interpersonal and communication skills with leadership capability.
• Team player with a commitment to environmental, health, safety, and security compliance.

Required skills

• FIB operation
• Scanning Electron Microscopy (SEM)
• Energy Dispersive X‑ray Spectroscopy (EDX)
• Optical Microscopy (OM)
• Brightfield and Darkfield defect inspection
• Recipe creation for defect inspection tools
• Defect analysis and partition analysis
• Data tracking and reporting
• Automation of troubleshooting processes
• Wafer quality control and authority to halt production