Application / Process Engineer – Die Bond Tools

About the role

The Application / Process Engineer will lead the development, optimisation and validation of die‑bonding processes and equipment for semiconductor packaging. Working from our Tanjong Pagar office, you will collaborate with cross‑functional teams to deliver high‑performance solutions to customers.

Key responsibilities

• Develop, optimise and validate die‑bonding processes, applications and equipment.
• Set up, calibrate and qualify machines to achieve optimum performance and production yield.
• Troubleshoot equipment and process issues and implement corrective actions.
• Create process recipes, test procedures and technical documentation.
• Provide technical support, equipment installation and on‑site assistance at customer sites.
• Conduct customer training and support field application engineers.
• Liaise with customers to understand requirements and recommend suitable semiconductor packaging solutions.
• Gather feedback and work with R&D on product improvements.

Required profile

• Bachelor's or Master's degree in Mechanical, Electrical, Materials Engineering or a related discipline.
• Minimum 3 years of experience in semiconductor packaging, die‑bonding equipment or advanced electronics manufacturing.
• Good knowledge of advanced semiconductor packaging technologies such as Flip Chip, PoP, WLP and PLP.
• Hands‑on troubleshooting and problem‑solving experience in a manufacturing or laboratory environment.
• Strong communication skills and ability to work independently and in a team.
• Willingness to travel for customer support and equipment installation.

Required skills

• Die bonding process development
• Semiconductor packaging technologies
• Motion control systems
• Equipment calibration and qualification
• Process development and optimisation