Process Engineering Intern – Hybrid Bonding

About the role

Applied Materials, a global leader in materials science and engineering solutions for semiconductor and advanced display technologies, is seeking a Process Engineering Intern focused on hybrid bonding. The internship offers hands‑on experience in advanced packaging and exposure to cleanroom environments, supporting the development of next‑generation semiconductor chips.

Key responsibilities

• Design, collect data, analyze and compile reports on entry‑level process engineering experiments under supervision and within safety guidelines.
• Support process engineers on tool development, DOE execution, data collection, and data analysis & interpretation to characterize the industrial system under development.
• Operate and gather data from a variety of industrial and laboratory metrology and inspection tools used in hybrid bonding technology.

Required profile

• Demonstrates conceptual knowledge in the discipline and seeks to broaden capabilities.
• No supervisory responsibilities but interacts with co‑workers and resources to accomplish assigned projects.
• Solves problems in straightforward situations using technical experience, judgment, and precedents.
• Impacts the quality of own work and that of the team while working within guidelines and policies.

What we offer

• Supportive work culture that encourages learning, development, and career growth.
• Health and wellbeing programs that support employees at work, at home, and wherever they may go.
• Opportunities to work in a cleanroom environment and gain exposure to advanced packaging and hybrid bonding system development.
• Access to state‑of‑the‑art equipment and mentorship from experienced process engineers.