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CE PYE Failure Analysis Engineer

micron · Msb

New
Mid 🇬🇧 English
Fault isolation Failure analysis Electrical device characterization NAND/DRAM/HBM devices Fab processes

Job description

About the role

Micron Technology, Inc. is looking for a CE PYE Failure Analysis (FA) Engineer to join its NAND Central Engineering-Product Yield Enhancement (PYE) team. The engineer provides full fault isolation and failure analysis support for qualifications, new device introductions and test failures, working with Product Engineering teams to isolate electrical failures. The role also involves leading and guiding a team of CE PYE technicians.

Key responsibilities

  • Perform sophisticated electrical device characterization to determine electrical fail mechanisms.
  • Operate fault isolation equipment to narrow down failure defect locations.
  • Conduct physical failure analysis to identify and classify physical defects.
  • Hypothesize electrical or process fail mechanisms from detailed electrical fail models and characterization, supporting process improvement.
  • Collaborate with teams from frontend to backend and the Global Quality department to resolve defectivity issues.
  • Prepare and present electrical and physical failure mechanisms weekly to drive continuous improvement.
  • Develop and implement new fault isolation and physical failure analysis techniques.
  • Lead and guide a team of CE PYE technicians.
  • Coordinate the maintenance and high uptime of fault isolation and failure analysis tools.
  • Integrate AI-assisted tools and insights into daily work and share AI-enabled improvements.

Required profile

  • Bachelor's or Master's degree in Electrical/Electronic Engineering, Microelectronics or Material Science.
  • Proven experience as a team player with strong analytical and problem-solving skills.
  • Excellent communication skills, able to present complex information in large meetings.
  • Ability to support shift rotation as required.

Required skills

  • Knowledge of fault isolation equipment, techniques and physical failure analysis is a significant advantage.
  • Strong understanding of NAND/DRAM/HBM devices and knowledge of fab processes is desirable.
  • Exposure to AI/machine learning or data analytics in engineering or manufacturing is beneficial.

Questions fréquentes

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Msb