College Intern - Packaging Engineering

About the role

HP is looking for a college intern in Packaging Engineering in Singapore. The intern supports experienced packaging engineers in designing and developing packaging solutions for Ink Supplies products, working on packaging concepts, validation and qualification, and collaborating with cross-functional teams.

Key responsibilities

• Support the design and development of packaging solutions for Ink Supplies products.
• Create packaging concepts, specifications, drawings and documentation.
• Take part in validation and qualification testing for form, fit, function, shock, vibration, compression and environmental performance.
• Collect, analyse and summarise test data, and prepare reports and recommendations for engineering review.
• Support packaging cost reduction, sustainability and efficiency improvement initiatives.
• Assist with qualification builds, manufacturing trials and packaging implementation.
• Work with Quality, Manufacturing, Procurement, Marketing and NPI teams.
• Research packaging materials, emerging technologies, industry trends and sustainability opportunities.
• Maintain engineering documentation, specifications and project records, and present project updates to engineering teams.

Required profile

• Currently pursuing a Bachelor's or Master's degree in Packaging, Mechanical, Industrial, Manufacturing Engineering, Materials Science or a related field.
• Able to commit to a 5-6 month full-time internship starting in January 2027.
• Previous internship, academic project or laboratory experience related to packaging, product development, manufacturing or testing.
• Interest in sustainability and circular economy principles.
• Strong analytical and problem-solving skills, teamwork ability, eagerness to learn and attention to detail.

Required skills

• Basic understanding of packaging design principles, materials and manufacturing processes.
• Proficiency in Microsoft Office (Excel, PowerPoint, Word).
• Familiarity with CAD tools such as SolidWorks, Creo, NX, AutoCAD or TOPS is a plus.