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Distinguished Member of Technical Staff - Cell Film, NAND Process Development

micron · Fab 10N/X

New
Senior 🇬🇧 English
ALD CVD SIMS XPS TEM EELS APT Process-device correlation Reliability modeling Failure analysis

Job description

About the role

Micron is looking for a Distinguished Member of Technical Staff (DMTS) for its Cell Film process development team in NAND. The DMTS is a recognized expert who shapes the technical vision for cell film processes, leads programs across the engineering group, mentors senior technical leaders and owns the cell film process technology roadmap.

Key responsibilities

  • Shape the technical vision for cell film and lead enterprise-wide programs that drive breakthroughs.
  • Influence industry and cross-disciplinary teams through external collaborations, consortia, conferences and collaborative research.
  • Mentor senior technical leaders and guide roadmap decisions that differentiate Micron products.
  • Solve the most challenging technical problems through comprehensive root cause analysis and advocate for cost savings, efficiency and large-scale yield enhancement.
  • Prepare high-impact technical presentations, white papers and patent filings, and initiate collaborations with universities and research institutes.
  • Assess technical risks and make informed decisions on priorities and investments.
  • Use AI-assisted tools to improve efficiency, quality and effectiveness, and share AI-enabled improvements within the team.

Required profile

  • PhD with at least 15 years, or Master's degree with at least 17 years, of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
  • Experience in thin film R&D for NAND, specifically diffusion, CVD and cell film technologies.
  • Proven track record of architecting technical solutions and process-device correlation.
  • Publications, patents and a strong record of technical contributions.

Required skills

  • Deep expertise in ALD/CVD thin film technologies and new deposition methods, materials and integration strategies for 3D NAND scaling.
  • Process-device correlation, reliability modeling, advanced failure analysis and canonical models.
  • Advanced characterization and electrical evaluation: SIMS, XPS, TEM, EELS, APT, electrical stress testing, ML-assisted image analysis.
  • Structured problem solving, clear communication and cross-functional collaboration.

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Fab 10N/X