Engineer, HIG‑HBM Product Engineering (Media Health Reliability Coding)

About the role

As a key member of Micron’s High Bandwidth Memory (HBM) Product Engineering Media Health team, you will develop and maintain reliability test programs for the latest HBM devices and packages. You will work on both intrinsic and extrinsic reliability assessments, ensuring that products meet stringent quality, cost and cycle‑time targets.

Key responsibilities

• Write, debug and optimise test programs for HBM device and package qualification.
• Develop new reliability test flows such as extended wafer‑level burn‑in, pWLRx, ELFR, and extrinsic DPM analyses.
• Analyse test data using in‑house statistical tools to validate performance and assess risk.
• Define interface hardware specifications and validate new interface boards.
• Collaborate with Fab, HBM Technology Development, Design, System Development and Quality teams to resolve root‑cause issues.
• Promote innovative reliability features and code‑infrastructure improvements.

Required profile

• Fresh or entry‑level graduate with a strong engineering foundation.
• Excellent problem‑solving abilities and attention to detail.
• Ability to work cross‑functionally and communicate technical concepts clearly.

Required skills

• Test program coding and debugging.
• Statistical data analysis for validation and risk assessment.
• Hardware specification definition and board validation.

What we offer

• Competitive monthly salary (SGD 5,000 – 6,900).
• Opportunity to work on cutting‑edge HBM technology in a global semiconductor leader.
• Collaborative environment with cross‑functional teams.